Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12162749 | Bond wave optimization method and device | Kang-Yi Lien, I-Hsuan Chiu, Yi Huang, Kuan-Chi Tsai, Hsiang-Fu Chen | 2024-12-10 |
| 12139399 | Conductive bond structure to increase membrane sensitivity in MEMS device | Hung-Hua Lin, Xin-Hua Huang, Yuan-Chih Hsieh | 2024-11-12 |