Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12015001 | Bonding structure and method thereof | Wen-Chuan Tai, Hsiang-Fu Chen, Li Peng | 2024-06-18 |
| 11984261 | Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device | Anderson Lin, Chun-Ren Cheng, Chi-Yuan Shih, Shih-Fen Huang, Yi-Chuan Teng +6 more | 2024-05-14 |