Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12123846 | Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via | Allen Timothy Chang, Jui-Cheng Huang, Yu-Jie Huang | 2024-10-22 |
| 12123871 | Biosensor system with integrated microneedle | Allen Timothy Chang, Jui-Cheng Huang, Yu-Jie Huang | 2024-10-22 |
| 12015001 | Bonding structure and method thereof | Fan Hu, Hsiang-Fu Chen, Li Peng | 2024-06-18 |