Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12125712 | Landing metal etch process for improved overlay control | Chih-Min HSIAO, Chih-Ming Lai, Ya Hui Chang, Ru-Gun Liu | 2024-10-22 |
| 12080544 | Stacked wafer structure and method for forming the same | Yu-Chen Chang, Chih-Min HSIAO | 2024-09-03 |
| 12062543 | Line-end extension method and device | Chih-Min HSIAO, Ru-Gun Liu, Chih-Ming Lai, Shih-Ming Chang, Yung-Sung Yen +1 more | 2024-08-13 |
| 12014926 | Self aligned litho etch process patterning method | Chih-Min HSIAO, Shih-Chun Huang, Yung-Sung Yen, Chih-Ming Lai, Ru-Gun Liu | 2024-06-18 |
| 11955338 | Directional deposition for semiconductor fabrication | Shih-Chun Huang, Ya-Wen Yeh, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen +3 more | 2024-04-09 |
| 11862465 | Fine line patterning methods | Shih-Chun Huang, Chiu-Hsiang Chen, Ya-Wen Yeh, Yu-Tien Shen, Po-Chin Chang +7 more | 2024-01-02 |