Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168709 | Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module | Koji Morita, Ryo Shimokawa, Shinji Tsuchikawa, Keiichi Kasuga, Tomio Iwasaki | 2024-12-17 |
| 12024624 | Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | Naoyoshi Sato, Shuji Gozu, Minoru Kakitani, Takao Tanigawa, Ryuji Akebi | 2024-07-02 |