Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12024624 | Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | Naoyoshi Sato, Shuji Gozu, Takao Tanigawa, Ryuji Akebi, Chihiro Hayashi | 2024-07-02 |