Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12110414 | Method for suppressing corrosion under heat-insulating material, and paste for suppressing corrosion under heat-insulating material | Hiroyuki Izumi, Tatsuya Makino, Tomohiko KOTAKE, Satoshi Takayasu | 2024-10-08 |
| 12024624 | Maleimide resin composition, prepreg, laminated board, resin film, printed wiring board, and semiconductor package | Shuji Gozu, Minoru Kakitani, Takao Tanigawa, Ryuji Akebi, Chihiro Hayashi | 2024-07-02 |