Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12168709 | Thermosetting resin composition, prepreg, laminate, metal-clad laminate, printed wiring board, and high-speed communication compatible module | Koji Morita, Ryo Shimokawa, Shinji Tsuchikawa, Keiichi Kasuga, Chihiro Hayashi | 2024-12-17 |