Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159179 | Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof | Lin Chen, Qingqing Sun, Wei Zhang | 2024-12-03 |
| 11887912 | Through silicon via structure for three-dimensional integrated circuit packaging and manufacturing method thereof | Lin Chen, Qingqing Sun, Wei Zhang | 2024-01-30 |
| 11881442 | SOI active transfer board for three-dimensional packaging and preparation method thereof | Lin Chen, Qingqing Sun, Wei Zhang | 2024-01-23 |