Issued Patents 2024
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159179 | Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof | Bao Zhu, Lin Chen, Qingqing Sun | 2024-12-03 |
| 12119416 | Buffer layers for photovoltaic devices with group V doping | Le Chen, Sachit Grover, Jason Kephart, Sergei Kniajanski, Chungho Lee +6 more | 2024-10-15 |
| 12009809 | Drive module for GaN transistor, switch circuit and electronic device | Min Xu, Jian Jin, Mengyuan Sun, Bin Wang | 2024-06-11 |
| 11988655 | Combined platform for testing fireproof materials for cables | Chenying Li, Jie Chen, Xiao TAN, Yijun FEI, Jingying Cao +8 more | 2024-05-21 |
| 11951271 | Method of manufacturing an in-plane metal microneedle array | Guojun Ma, Chengwei Wu, Xiaolong An, Xiao Han, Yongtao LV +1 more | 2024-04-09 |
| D1015540 | Combined anesthesia machine and breathing device | Ryan W. Rindy, Hui Fang, Jun Hou, Eero Tapio Hyytiainen, Jiancheng Zhang +3 more | 2024-02-20 |
| 11905378 | High-grafting density cyclic comb shaped polymer and preparation method therefor | Shuangshuang Zhang, Jieai Li, Xiulin ZHU, Zhengbiao Zhang, Nianchen Zhou | 2024-02-20 |
| 11887912 | Through silicon via structure for three-dimensional integrated circuit packaging and manufacturing method thereof | Bao Zhu, Lin Chen, Qingqing Sun | 2024-01-30 |
| 11881442 | SOI active transfer board for three-dimensional packaging and preparation method thereof | Bao Zhu, Lin Chen, Qingqing Sun | 2024-01-23 |
| 11869827 | Three-dimensional capacitor-inductor based on high functional density through silicon via structure and preparation method thereof | Ziyu Liu, Lin Chen, Qingqing Sun | 2024-01-09 |
| 11860187 | Modified method to fit cell elastic modulus based on Sneddon model | Weihao Sun, Chengwei Wu, Jianli Ma | 2024-01-02 |