Issued Patents 2024
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159179 | Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof | Bao Zhu, Qingqing Sun, Wei Zhang | 2024-12-03 |
| 12094051 | Processing device and processing method for ray tracing acceleration structure | Feng Han | 2024-09-17 |
| 12095654 | Interconnection device | Qin Zheng, Zhou Hong, Yufei Zhang, Chengkun Sun, Tong Sun +2 more | 2024-09-17 |
| 11900175 | Computing device, computing equipment and programmable scheduling method | Zhou Hong, Yufei Zhang, Chengkun Sun | 2024-02-13 |
| 11887912 | Through silicon via structure for three-dimensional integrated circuit packaging and manufacturing method thereof | Bao Zhu, Qingqing Sun, Wei Zhang | 2024-01-30 |
| 11881442 | SOI active transfer board for three-dimensional packaging and preparation method thereof | Bao Zhu, Qingqing Sun, Wei Zhang | 2024-01-23 |
| 11869827 | Three-dimensional capacitor-inductor based on high functional density through silicon via structure and preparation method thereof | Wei Zhang, Ziyu Liu, Qingqing Sun | 2024-01-09 |