Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159179 | Three-dimensional integrated system of RFID chip and super capacitor and preparation method thereof | Bao Zhu, Lin Chen, Wei Zhang | 2024-12-03 |
| 11887912 | Through silicon via structure for three-dimensional integrated circuit packaging and manufacturing method thereof | Bao Zhu, Lin Chen, Wei Zhang | 2024-01-30 |
| 11881442 | SOI active transfer board for three-dimensional packaging and preparation method thereof | Bao Zhu, Lin Chen, Wei Zhang | 2024-01-23 |
| 11869827 | Three-dimensional capacitor-inductor based on high functional density through silicon via structure and preparation method thereof | Wei Zhang, Ziyu Liu, Lin Chen | 2024-01-09 |