Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12085976 | Semiconductor die, electronic component, electronic apparatus and manufacturing method thereof | Yikai Liang, Junhai Liu, Wenqi Li, Dongcai Li, Zheng Tian | 2024-09-10 |
| 12027512 | Chipset and manufacturing method thereof | Shiqun Gu | 2024-07-02 |
| 12019117 | Chip and chip test method | Kai LEI, Yikai Liang, Yudan Deng, Jinfu Ye, Huan Liu | 2024-06-25 |