Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12085976 | Semiconductor die, electronic component, electronic apparatus and manufacturing method thereof | Yikai Liang, Junhai Liu, Wenqi Li, Linglan Zhang, Zheng Tian | 2024-09-10 |