Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12085976 | Semiconductor die, electronic component, electronic apparatus and manufacturing method thereof | Junhai Liu, Wenqi Li, Linglan Zhang, Dongcai Li, Zheng Tian | 2024-09-10 |
| 12019117 | Chip and chip test method | Kai LEI, Yudan Deng, Linglan Zhang, Jinfu Ye, Huan Liu | 2024-06-25 |