Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154890 | Multi-tier IC package including processor and high bandwidth memory | Rui Niu, Tianqiang Huang | 2024-11-26 |
| 12027512 | Chipset and manufacturing method thereof | Linglan Zhang | 2024-07-02 |