Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154890 | Multi-tier IC package including processor and high bandwidth memory | Shiqun Gu, Tianqiang Huang | 2024-11-26 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12154890 | Multi-tier IC package including processor and high bandwidth memory | Shiqun Gu, Tianqiang Huang | 2024-11-26 |