Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183747 | Wiring layer and manufacturing method therefor | Tomoaki Moriwaka, Shinya Sasagawa, Takashi Ohtsuki | 2024-12-31 |
| 12074224 | Semiconductor device and manufacturing method thereof | Yoshinobu Asami, Satoru Okamoto, Shinya Sasagawa | 2024-08-27 |
| 12046683 | Semiconductor device | Akihisa Shimomura, Naoto Yamade, Tomoya TAKESHITA, Tetsuhiro Tanaka | 2024-07-23 |
| 11967649 | Semiconductor device | Toshihiko Takeuchi, Naoto Yamade, Sachiaki Tezuka, Shunpei Yamazaki | 2024-04-23 |
| 11901372 | Wiring layer and manufacturing method therefor | Tomoaki Moriwaka, Shinya Sasagawa, Takashi Ohtsuki | 2024-02-13 |