Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183747 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Shinya Sasagawa, Takashi Ohtsuki | 2024-12-31 |
| 12041765 | Capacitor, semiconductor device, and manufacturing method of semiconductor device | Yuichi Sato, Ryota HODO, Yuta Iida | 2024-07-16 |
| 11955538 | Semiconductor device and method for manufacturing semiconductor device | Shunpei Yamazaki, Toshihiko Takeuchi, Naoto Yamade, Hiroshi Fujiki, Shunsuke Kimura | 2024-04-09 |
| 11901372 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Shinya Sasagawa, Takashi Ohtsuki | 2024-02-13 |