Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183747 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Tomoaki Moriwaka, Shinya Sasagawa | 2024-12-31 |
| 11901372 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Tomoaki Moriwaka, Shinya Sasagawa | 2024-02-13 |