Issued Patents 2024
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183747 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Tomoaki Moriwaka, Takashi Ohtsuki | 2024-12-31 |
| 12176439 | Semiconductor device and method for manufacturing semiconductor device | Shunpei Yamazaki, Erika TAKAHASHI, Tsutomu Murakawa, Katsuaki TOCHIBAYASHI | 2024-12-24 |
| 12082390 | Method for manufacturing semiconductor device | Shunpei Yamazaki, Shunichi Ito, Erika TAKAHASHI, Tetsuya Kakehata | 2024-09-03 |
| 12074224 | Semiconductor device and manufacturing method thereof | Yoshinobu Asami, Yutaka Okazaki, Satoru Okamoto | 2024-08-27 |
| 12068198 | Method for manufacturing semiconductor device | Shunpei Yamazaki, Tsutomu Murakawa, Naoto Yamade, Takashi Hamada, Hiroki Komagata | 2024-08-20 |
| 12057508 | Semiconductor device and method for manufacturing semiconductor device | Shunpei Yamazaki, Shunichi Ito, Erika TAKAHASHI, Tetsuya Kakehata | 2024-08-06 |
| 12057480 | Semiconductor device | Shunpei Yamazaki, Erika TAKAHASHI, Katsuaki TOCHIBAYASHI, Ryo Arasawa | 2024-08-06 |
| 11935944 | Semiconductor device and method for fabricating the same | Shunpei Yamazaki, Hideomi Suzawa, Motomu Kurata, Masashi TSUBUKU | 2024-03-19 |
| 11929416 | Semiconductor device and method for manufacturing semiconductor device | Shunpei Yamazaki, Ryo Tokumaru, Tomonori Nakayama | 2024-03-12 |
| 11901372 | Wiring layer and manufacturing method therefor | Yutaka Okazaki, Tomoaki Moriwaka, Takashi Ohtsuki | 2024-02-13 |