Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183660 | Semiconductor device including through-silicon via and method of forming the same | Jeonil Lee, Jongmin Lee, Jimin Choi | 2024-12-31 |
| 12080663 | Semiconductor devices including a thick metal layer and a bump | Minjung Choi, Sooho Shin, Junghoon Han | 2024-09-03 |
| 12072374 | Detection pad structure for analysis in a semiconductor device | Jihoon Chang, Minjung Choi, Jimin Choi | 2024-08-27 |
| 11948882 | Semiconductor device and method of fabricating the same | Jihoon Chang, Jimin Choi, Hyeon-Woo Jang, Jung-Hoon Han | 2024-04-02 |