Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080663 | Semiconductor devices including a thick metal layer and a bump | Sooho Shin, Yeonjin Lee, Junghoon Han | 2024-09-03 |
| 12072374 | Detection pad structure for analysis in a semiconductor device | Jihoon Chang, Yeonjin Lee, Jimin Choi | 2024-08-27 |