Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12080663 | Semiconductor devices including a thick metal layer and a bump | Minjung Choi, Yeonjin Lee, Junghoon Han | 2024-09-03 |
SS
Sooho Shin
Overall (2024): #263,267 of 561,600Top 50%
1
Patents 2024