Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183660 | Semiconductor device including through-silicon via and method of forming the same | Jongmin Lee, Jimin Choi, Yeonjin Lee | 2024-12-31 |
| 12178034 | Semiconductor device including buried contact and method for manufacturing the same | Youngjun Kim, Jinbum Kim | 2024-12-24 |
| 12159859 | Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip | Jimin Choi, Jongmin Lee, Juik Lee | 2024-12-03 |