Issued Patents 2024
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12159859 | Thermal pad, semiconductor chip including the same and method of manufacturing the semiconductor chip | Jimin Choi, Jeonil Lee, Jongmin Lee | 2024-12-03 |
| 12040231 | Semiconductor device including TSV and multiple insulating layers | Junghoon Han | 2024-07-16 |