Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12090642 | Die pickup module and die bonding apparatus including the same | Chang Bu Jeong, Jong Sung Park, Jung Sub Kim, Young Gun Park, Dae Seok Choi +5 more | 2024-09-17 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12090642 | Die pickup module and die bonding apparatus including the same | Chang Bu Jeong, Jong Sung Park, Jung Sub Kim, Young Gun Park, Dae Seok Choi +5 more | 2024-09-17 |