CJ

Chang Bu Jeong

SC Semes Co.: 1 patents #101 of 327Top 35%
Samsung: 1 patents #7,344 of 17,120Top 45%
📍 Suneung-ri, KR: #487 of 1,162 inventorsTop 45%
Overall (2024): #511,754 of 561,600Top 95%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12090642 Die pickup module and die bonding apparatus including the same Jong Sung Park, Jung Sub Kim, Young Gun Park, Dae Seok Choi, Sang Hoon Jung +5 more 2024-09-17