YP

Young Gun Park

SC Semes Co.: 1 patents #101 of 327Top 35%
Samsung: 1 patents #7,344 of 17,120Top 45%
📍 Seoul, KR: #3,115 of 8,035 inventorsTop 40%
Overall (2024): #205,638 of 561,600Top 40%
1
Patents 2024

Issued Patents 2024

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
12090642 Die pickup module and die bonding apparatus including the same Chang Bu Jeong, Jong Sung Park, Jung Sub Kim, Dae Seok Choi, Sang Hoon Jung +5 more 2024-09-17