Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12090642 | Die pickup module and die bonding apparatus including the same | Chang Bu Jeong, Jong Sung Park, Jung Sub Kim, Young Gun Park, Sang Hoon Jung +5 more | 2024-09-17 |
DC
Dae Seok Choi
Semes Co.: 1 patents #101 of 327Top 35%
Overall (2024): #497,869 of 561,600Top 90%
1
Patents 2024