Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132007 | Semiconductor package | Jongwan Kim, Juhyeon Oh, Yongkwan Lee | 2024-10-29 |
| 12057357 | Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses | Jongwan Kim, Juhyeon Oh, Yongkwan Lee | 2024-08-06 |
| 11996365 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Jun Young Oh, Sangsoo Kim, Dong-Ju Jang | 2024-05-28 |