Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996365 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim | 2024-05-28 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11996365 | Semiconductor package and a method of fabricating the same | Jongho Park, Seung Hwan Kim, Jun Young Oh, Kyong Hwan Koh, Sangsoo Kim | 2024-05-28 |