Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132007 | Semiconductor package | Jongwan Kim, Kyong Hwan Koh, Yongkwan Lee | 2024-10-29 |
| 12057357 | Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses | Kyong Hwan Koh, Jongwan Kim, Yongkwan Lee | 2024-08-06 |