Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132007 | Semiconductor package | Jongwan Kim, Kyong Hwan Koh, Juhyeon Oh | 2024-10-29 |
| 12087650 | Interposer and semiconductor package including the same | Junyoung Oh, Hyunggil Baek, Seunghwan KIM, Jungjoo Kim, Jongho Park | 2024-09-10 |
| 12057357 | Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses | Kyong Hwan Koh, Jongwan Kim, Juhyeon Oh | 2024-08-06 |