Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183694 | Semiconductor package including antenna | Yongkoon Lee, Sangkyu Lee, Seokkyu Choi | 2024-12-31 |
| 12040248 | Semiconductor package including heat spreader layer | Sangkyu Lee, Yongkoon Lee, Seokkyu Choi | 2024-07-16 |
| 12040299 | Semiconductor package and method of manufacturing the semiconductor package | Sangkyu Lee, Yongkoon Lee | 2024-07-16 |
| 11973042 | Semiconductor package | Shanghoon Seo, Sangkyu Lee, Jeongho Lee | 2024-04-30 |
| 11942434 | Method of manufacturing a semiconductor package | Sangkyu Lee, Kyungdon Mun, Shanghoon Seo, Jeongho Lee | 2024-03-26 |