Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11973042 | Semiconductor package | Jingu Kim, Sangkyu Lee, Jeongho Lee | 2024-04-30 |
| 11942434 | Method of manufacturing a semiconductor package | Sangkyu Lee, Jingu Kim, Kyungdon Mun, Jeongho Lee | 2024-03-26 |