Issued Patents 2024
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183694 | Semiconductor package including antenna | Jingu Kim, Sangkyu Lee, Seokkyu Choi | 2024-12-31 |
| 12040248 | Semiconductor package including heat spreader layer | Jingu Kim, Sangkyu Lee, Seokkyu Choi | 2024-07-16 |
| 12040299 | Semiconductor package and method of manufacturing the semiconductor package | Sangkyu Lee, Jingu Kim | 2024-07-16 |
| 11935847 | Semiconductor package | Myungsam Kang, Changbae Lee, Bongju Cho, Younggwan Ko, Moonil Kim +1 more | 2024-03-19 |
| 11935849 | Semiconductor package with an antenna substrate | Myungsam Kang, Sangkyu Lee | 2024-03-19 |