Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183694 | Semiconductor package including antenna | Yongkoon Lee, Jingu Kim, Sangkyu Lee | 2024-12-31 |
| 12040248 | Semiconductor package including heat spreader layer | Jingu Kim, Sangkyu Lee, Yongkoon Lee | 2024-07-16 |