Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084599 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Emi MIYAZAWA, Tsuyoshi Hayasaka, Takashi Kawamori, Shinichiro Sukata, Keisuke NISHIDO | 2024-09-10 |
| 11873414 | Sealing resin composition, electronic component device, and method of manufacturing electronic component device | Yuma Takeuchi, Hisato Takahashi | 2024-01-16 |