Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11873414 | Sealing resin composition, electronic component device, and method of manufacturing electronic component device | Hisato Takahashi, Yoshihito Inaba | 2024-01-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11873414 | Sealing resin composition, electronic component device, and method of manufacturing electronic component device | Hisato Takahashi, Yoshihito Inaba | 2024-01-16 |