Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12131970 | Liquid resin composition for sealing and electronic component apparatus | Hidetoshi Inoue, Takayuki Matsuzaki, Tsuyoshi KAMIMURA, Haruyuki Yoshii | 2024-10-29 |
| 11999875 | Polishing solution and polishing method | Yuya Otsuka, Hisataka Minami, Shingo Kobayashi, Mayumi KOMINE | 2024-06-04 |
| 11926764 | Polishing solution, polishing solution set, polishing method, and defect suppressing method | Masayuki Hanano, Toshio Takizawa | 2024-03-12 |
| 11873414 | Sealing resin composition, electronic component device, and method of manufacturing electronic component device | Yuma Takeuchi, Yoshihito Inaba | 2024-01-16 |