Issued Patents 2024
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12084599 | Semiconductor device manufacturing method, curable resin composition for temporary fixation material, film for temporary fixation material, and laminated film for temporary fixation material | Emi MIYAZAWA, Tsuyoshi Hayasaka, Takashi Kawamori, Yoshihito Inaba, Keisuke NISHIDO | 2024-09-10 |