Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12173151 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Hiroaki UMEHARA, Fumito Suzuki, Jun YASUMOTO | 2024-12-24 |
| 12122129 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Rihoko Watanabe, Yiqun Wang | 2024-10-22 |
| 12098257 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Hirosuke SAITO, Yiqun Wang | 2024-09-24 |
| 11945910 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Rihoko Watanabe, Yiqun Wang | 2024-04-02 |
| 11905409 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Kosuke Tsuda, Hirosuke SAITO, Yiqun Wang | 2024-02-20 |
| 11866580 | Polyphenylene ether resin composition, prepreg using same, film with resin, metal foil with resin, metal-clad laminate and wiring board | Hiroaki UMEHARA, Fumito Suzuki, Jun YASUMOTO | 2024-01-09 |