Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12098257 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Yiqun Wang, Hiroharu Inoue | 2024-09-24 |
| 11905409 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Kosuke Tsuda, Yiqun Wang, Hiroharu Inoue | 2024-02-20 |