Issued Patents 2024
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122129 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Rihoko Watanabe, Hiroharu Inoue | 2024-10-22 |
| 12098257 | Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board | Hirosuke SAITO, Hiroharu Inoue | 2024-09-24 |
| 12086233 | Lifecycle management of secrets on serverless platform | Bhaskardeep KHAUND, Bo Wu, Chen Shen | 2024-09-10 |
| 11945910 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Rihoko Watanabe, Hiroharu Inoue | 2024-04-02 |
| 11949526 | Dynamic video layout design during online meetings | Yun-Chuan Teng, Wen Jiang, Shujun Han, Lin Wang | 2024-04-02 |
| 11905409 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Kosuke Tsuda, Hirosuke SAITO, Hiroharu Inoue | 2024-02-20 |