Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122129 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Hiroharu Inoue, Yiqun Wang | 2024-10-22 |
| 11945910 | Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition | Hiroaki UMEHARA, Hiroharu Inoue, Yiqun Wang | 2024-04-02 |