Issued Patents 2024
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166006 | Bonding wire for semiconductor devices | Tomohiro Uno, Daizo Oda, Motoki ETO | 2024-12-10 |
| 12132025 | Bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO +2 more | 2024-09-17 |