Issued Patents 2024
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12132025 | Bonding wire | Takashi Yamada, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-09-17 |