Issued Patents 2024
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166006 | Bonding wire for semiconductor devices | Tomohiro Uno, Tetsuya OYAMADA, Daizo Oda | 2024-12-10 |
| 12132025 | Bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Tetsuya OYAMADA +2 more | 2024-10-29 |
| 12090578 | Al bonding wire | Takashi Yamada, Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Tetsuya OYAMADA +2 more | 2024-09-17 |
| 11929343 | Bonding wire for semiconductor devices | Daizo Oda, Takashi Yamada, Teruo Haibara, Ryo OISHI | 2024-03-12 |