Issued Patents 2024
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12140133 | Dispenser | — | 2024-11-12 |
| 12132025 | Bonding wire | Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-10-29 |
| 12124086 | Optical fiber connection structure | Yuichiro Ikuma, Yusuke Nasu | 2024-10-22 |
| 12119793 | Power amplifier module | Satoshi Tanaka, Yasuhisa Yamamoto | 2024-10-15 |
| 12114157 | Service start method and communication system | Manabu YOSHINO, Hiroo Suzuki, Jun-ichi Kani | 2024-10-08 |
| 12090578 | Al bonding wire | Akihito Nishibayashi, Teruo Haibara, Daizo Oda, Motoki ETO, Tetsuya OYAMADA +2 more | 2024-09-17 |
| 12078851 | Optical module | Shunichi Soma, Yusuke Nasu, Ken Tsuzuki, Kiyofumi Kikuchi | 2024-09-03 |
| 12058475 | Video display system, video conversion device, and video display method | Yoshinori Okazaki, Yoshito Tanaka, Daizaburo Matsuki, Yoshifumi Kawaguchi | 2024-08-06 |
| 12055765 | Optical module | Yuriko Kawamura, Yusuke Nasu | 2024-08-06 |
| D1037007 | Pump dispenser | — | 2024-07-30 |
| 12038614 | Optical fiber array and connecting method thereof | Yuichiro Ikuma | 2024-07-16 |
| 12020427 | Differentiation device, differentiation method for depression symptoms, determination method for level of depression symptoms, stratification method for depression patients, determination method for effects of treatment of depression symptoms, and brain activity training device | Giuseppe Lisi, Jun Morimoto, Mitsuo Kawato, Naho ICHIKAWA, Yasumasa OKAMOTO | 2024-06-25 |
| 11993268 | Information processing apparatus, moving body, computer-readable recording medium and method | Kazunori Tokunaga, Mafuyu KOSEKI, Toshiaki Takano, Satoshi Onodera | 2024-05-28 |
| 11982837 | Interposer circuit | Yuichiro Ikuma, Yusuke Nasu, Manabu Oguma | 2024-05-14 |
| 11954416 | Non-transitory computer readable recording medium storing a computer program, simulation method and simulation device for simulating dynamic behavior of electromagnetic component | Koji Tani | 2024-04-09 |
| 11929343 | Bonding wire for semiconductor devices | Daizo Oda, Motoki ETO, Teruo Haibara, Ryo OISHI | 2024-03-12 |